Developing Embedded Technologies for the Future
Senitro GmbH excels in providing bespoke hardware and software development solutions, with our engineering services closely focused on the unique needs of each customer.
Wire Bonding Service
We offer Wire Bonding Services for small series production and prototypes, delivering high quality, flexibility, and cost efficiency.
Our services include:
- Chip on Board (COB)
- Chip on Package (COP)
We work with automated bonding equipment to ensure consistent and reliable results. Our focus is on practical, cost-effective solutions with short turnaround times — typically within a few days
Our Capabilities:
- Wedge–Wedge Bonding Technology
- Gold Wire Bonding
- Aluminum Wire Bonding
- Chip Bonding Services
- Fast turnaround time – service within just a few days
If you have a specific project or technical requirements, feel free to contact us.
About Us
We Build New Future With Best Technology
Our service includes the development of prototypes that are used to test your components and applications in real-world scenarios. We deliberately expose them to the challenging conditions they will have to overcome after their installation. This ensures that they reliably meet your specific requirements.
- Free Consultations
- Expert Client Service
- Affordable Pricing
- Technical Assistance
- Innovative Solutions
- Aftersales Support
Chief Executive Officer
Our Services
What Service We Offer
All stages of the electronics development are covered by our specialists. Full-time support, meeting the requirements and expectations and satisfaction of the customers is the goal during the whole project’s lifespan.
Circuit design
Design and development of analogue and digital circuits for devices from the industrial, medical and automotive sectors.
PCB Layout
Professional layout for multilayer printed circuit boards and for high-tech flexible circuit boards.
Assembly
Assembly of first prototypes for functional block testing and delivery to customer for further analysis.
Software development
Development of software and firmware for embedded systems, customisation of the embedded functions.
IC design
An ASIC design project consists of five main stages: specification, design, prototyping, evaluation and transfer to production.
Manufacturing
Samples manufacturing and mass production are offered in collaboration with technological partners.